FLC
The Film Laser Cutting system handles multiple processes of cutting, peeling, and cleaning of a film or sheet. With two types of laser, it processes full-cutting to cut films and half-cutting to cut only upper layers from the multiple layers of films with CO2 laser and higher accuracy cutting process with UV laser. Available for large-size substrates, this system can meet the mass-production needs.
Application: Laser processing (Cutting/detaching/Washing)
Industry: Flexible Display (Smartphone, In-Vehicle, PC, etc.)
It is used to manufacture flexible OLED displays.
| Process | Laser cut (Full/Half/Pad cuts) Peeling Plasma cleaning Visual inspection |
|---|---|
| Laser type | CO2 Laser, UV Laser |
| Cutting accuracy | ≤ ± 50 µm |

*YIELDEdGE: Japanese Registered Trademark (Number 6576710)
