Company
Products
- Laser Annealing System for Silicidation
- Laser Annealing System for Activation
- Micro Laser Annealing System
- Laser Processing System for Semiconductors
- Excimer Laser Annealing System
- Laser Lift-Off System
- Film Laser Cutting System
- Laser Micro Drilling System
Technical Dictionary Glossary
Services and Solutions
- Services
- Solutions
Contact
> 日本語

Products

HOME
Products

Semiconductor manufacturing system

Laser Annealing System
for SilicidationYIELDSCAN
Laser Annealing System
for ActivationYIELDSCAN SLA
Micro Laser Annealing SystemYIELDSCAN MLA

For R&D

Laser Processing Syste
for Semiconductors

FPD manufacturing system

Excimer Laser Annealing SystemYIELDSCAN ELA
Laser Lift-Off SystemYIELDSCAN LLO
Film Laser Cutting SystemYIELDEdGE FLC

Other manufacturing system

Laser Micro Drilling SystemYIELDvia ELD

Company information

Products
- Laser Annealing System
  for Silicidation
- Laser Annealing System
  for Activation
- Micro Laser Annealing System
- Laser Processing System
  for Semiconductors
- Excimer Laser Annealing System
- Laser Lift-Off System
- Film Laser Cutting System
- Laser Micro Drilling System

Technical Dictionary Glossary
Services and Solutions
- Services
- Solutions

Contact

2-1, Fukuura 2-chome,
Kanazawa-ku, Yokohama-shi,
Kanagawa 236-0004, Japan

TEL: +81-45-787-8462
FAX: +81-45-785-1379

Site Policy ｜ Privacy Policy ｜ Purpose of utilizing the personal information

Copyright © JSW Aktina System Co., Ltd. All rights reserved.

Page top